1.0mm Pitch SMT Wafer Connector

$2.00

High-Performance 1.0mm Pitch SMT Wafer Connector – Vertical & Right-Angle (2P-20P)
• Product Type: Professional 1.0mm Pitch SMT (Surface Mount) Wafer.
• Mounting Styles: Available in Vertical (Top Entry) and Right-Angle (Side Entry) to maximize PCB layout flexibility.
• Material: High-temperature LCP (UL94V-0) housing, engineered for lead-free reflow soldering (Peak 260°C).
• Pin Range: Comprehensive configurations from 2P up to 20P.
• Compatibility: Fully compatible with industry-standard 1.0mm pitch wire-to-board systems.
• Quality: RoHS & REACH compliant; 100% electrical testing for zero-defect assembly.
Looking for a technical drawing,  or a bulk quote? Contact our engineering team today for immediate assistance!

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    SKU: LYD10SMT Category: Brand:

    Precision 1.0mm Pitch SMT Wafer Connector: The Ultimate Wire-to-Board Interface

    Our 1.0mm Pitch SMT Wafer Connectors are precision-engineered for high-density electronic applications where reliability and space-efficiency are paramount. Designed for seamless integration into automated production lines, these wafers provide a secure, low-profile connection that meets the rigorous standards of the European and American industrial and consumer markets.
    Dual Configuration for Versatile Design
    Engineers can choose between two standard orientations to fit their specific PCB architecture:
    • Vertical SMT (Top Entry): Optimized for straight-mating, saving horizontal board space and ideal for stacked PCB designs.
    • Right-Angle SMT (Side Entry): Features a horizontal mating profile, perfect for ultra-thin devices where vertical height is limited.

    Feature Specification
    Pitch 1.0mm (0.039″)
    Circuits (Positions) 2P – 20P
    Mounting Type Surface Mount Technology (SMT/SMD)
    Current Rating 1.0A AC/DC
    Voltage Rating 50V AC/DC
    Insulation Material LCP (Liquid Crystal Polymer), Halogen-free
    Contact Material High-conductivity Phosphor Bronze
    Operating Temperature -40°C to +105°C

    Advanced Manufacturing Features

    1. Reflow Soldering Optimized: Utilizing premium LCP materials, our wafers maintain exceptional dimensional stability during high-temperature lead-free reflow processes.

    2. Enhanced Mechanical Strength: Equipped with robust metal solder tabs (nails) to ensure superior PCB retention and strain relief for the solder joints.

    3. Automated Assembly Ready: All parts are available in Tape and Reel (T&R) packaging, featuring pick-and-place caps for efficient, high-speed automated assembly.

    4. Anti-Oxidation Plating: High-quality tin or selective gold plating ensures low contact resistance and long-term durability in humid or industrial environments.

    Typical Applications

    • Consumer Electronics: Smart home IoT modules, tablets, and gaming peripherals.

    • Industrial Automation: PLC modules, micro-sensors, and robotic controllers.

    • Medical Technology: Portable diagnostic tools and patient monitoring systems.

    • Automotive: Infotainment systems, LED lighting modules, and ADAS sensors.

    Why Partner with Us?

    As your high-end technical partner, we provide more than just components. We offer:

    • Engineering Support: Full access to 2D/3D CAD models to accelerate your design cycle.

    • Global Compliance: Strict adherence to international environmental and safety standards.

    • Customization: Tailored solutions including custom pin counts, plating thicknesses, and specialized packaging.

    Customization Available:
    For custom lengths or bulk pricing, please email us:
    nick.xu@lyd123.com

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